8 August 1977 Overview Of Advances In Photomask Substrate Flatness Requirements And Flatness Measurement Techniques
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Abstract
The continued demand by the integrated circuit industry for larger wafers and higher device densities has placed requirements in the photolithographic manufacturing system for "superflat" substrate glass. Superflat substrates are flatter than current master grades and are primarily used in projection printing. The accurate and consistent measurement of this glass as it relates to both the vendor/purchaser and the test/use situations is examined. This is accomplished through both an overview of the industry's status as well as specific measurement and computer generated data. The study concludes that while the industry objective of much flatter substrate glass is clearly established, the procedures and equipment used to measure this flatness have not, heretofore, been well defined.
© (1977) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Raymond F. Leinen, Raymond F. Leinen, "Overview Of Advances In Photomask Substrate Flatness Requirements And Flatness Measurement Techniques", Proc. SPIE 0100, Developments in Semiconductor Microlithography II, (8 August 1977); doi: 10.1117/12.955356; https://doi.org/10.1117/12.955356
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