Translator Disclaimer
8 August 1977 Overview Of Advances In Photomask Substrate Flatness Requirements And Flatness Measurement Techniques
Author Affiliations +
Abstract
The continued demand by the integrated circuit industry for larger wafers and higher device densities has placed requirements in the photolithographic manufacturing system for "superflat" substrate glass. Superflat substrates are flatter than current master grades and are primarily used in projection printing. The accurate and consistent measurement of this glass as it relates to both the vendor/purchaser and the test/use situations is examined. This is accomplished through both an overview of the industry's status as well as specific measurement and computer generated data. The study concludes that while the industry objective of much flatter substrate glass is clearly established, the procedures and equipment used to measure this flatness have not, heretofore, been well defined.
© (1977) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Raymond F. Leinen II "Overview Of Advances In Photomask Substrate Flatness Requirements And Flatness Measurement Techniques", Proc. SPIE 0100, Developments in Semiconductor Microlithography II, (8 August 1977); https://doi.org/10.1117/12.955356
PROCEEDINGS
6 PAGES


SHARE
Advertisement
Advertisement
RELATED CONTENT

Looking back artwork and mask making in Dresden for...
Proceedings of SPIE (June 02 2004)
Masking With Matched Sets
Proceedings of SPIE (September 20 1976)
New concept of specification for mask flatness
Proceedings of SPIE (August 01 2002)
A New Step By Step Aligner For Very Large Scale...
Proceedings of SPIE (September 05 1980)

Back to Top