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8 August 1977 Projection Printing Characterization
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Abstract
Projection printing eliminates the problems introduced by hard-contacting the mask to the wafer while maintaining the high resolution requirements of the integrated circuit manufacturer. Certain advantages of projection printing are obvious: the wafers are not contaminated or damaged by contact with the mask, and the mask will not wear out. Less obvious are the steps required to maximize the advantages of projection printing, thereby reducing costs and increasing yields. This paper considers photoresist choices, suggests some procedures to determine process variables, and discusses mask costs and quality effects.
© (1977) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
John W. Bossung "Projection Printing Characterization", Proc. SPIE 0100, Developments in Semiconductor Microlithography II, (8 August 1977); https://doi.org/10.1117/12.955357
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