In order to accurately achieve VLSI micro-lithography for integrated circuit applications, with high throughput, new optical printing systems are required. The manufacturer of a projection alignment system must contend with and solve numerous problems in optical, electronic, and mechanical technologies. This paper describes a new projection aligner, and the solutions which were employed to achieve the desired goals. Test results are given where applicable. Included is the basic optical concept, methods of achieving VLSI precision alignment, operator-machine interaction, and the high intensity exposure system. In addition, for VLSI imaging,an automatic focusing system has been designed which monitors the focus of the wafer through the actual optical path. A system of automatic wafer alignment will also be described.