17 July 1979 New Generation Of 1:1 Optical Projection Mask Aligners
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Abstract
The increased density of today's VLSI circuits requires a tighter control at all semi-conductor processing parameters. Included is the need for improved lithography. This paper describes a new 1:1 projection mask aligner that uses ring-field reflective optics. Described are the improvements made in the optical design and fabrication, temperature control, vibration and alignment systems all of which are required to achieve a 2-micrometer production performance. The results of the improvements are presented in terms of lithography on resist-coated silicon wafers.
© (1979) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Michael C. King, Edward S. Muraski, "New Generation Of 1:1 Optical Projection Mask Aligners", Proc. SPIE 0174, Developments in Semiconductor Microlithography IV, (17 July 1979); doi: 10.1117/12.957180; https://doi.org/10.1117/12.957180
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KEYWORDS
Photomasks

Optical alignment

Semiconducting wafers

Control systems

Projection systems

Optical lithography

Very large scale integration

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