17 July 1979 New Generation Of 1:1 Optical Projection Mask Aligners
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Abstract
The increased density of today's VLSI circuits requires a tighter control at all semi-conductor processing parameters. Included is the need for improved lithography. This paper describes a new 1:1 projection mask aligner that uses ring-field reflective optics. Described are the improvements made in the optical design and fabrication, temperature control, vibration and alignment systems all of which are required to achieve a 2-micrometer production performance. The results of the improvements are presented in terms of lithography on resist-coated silicon wafers.
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Michael C. King, Michael C. King, Edward S. Muraski, Edward S. Muraski, } "New Generation Of 1:1 Optical Projection Mask Aligners", Proc. SPIE 0174, Developments in Semiconductor Microlithography IV, (17 July 1979); doi: 10.1117/12.957180; https://doi.org/10.1117/12.957180
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