Testing The Mann Type 4800DSWTM Wafer Steppertm

William C. Schneider

doi:10.1117/12.957172

17 July 1979 Testing The Mann Type 4800DSW^TMWafer Steppertm

William C. Schneider

Proceedings Volume 0174, Developments in Semiconductor Microlithography IV; (1979) https://doi.org/10.1117/12.957172
Event: Developments in Semiconductor Microlithography IV, 1979, San Jose, United States

Abstract

This paper discusses the use of vernier measuring techniques to determine various errors associated with step-and-repeat mechanisms. The design of GCA Burlington's Universal Vernier Test Target is described and the application of this target to measure reduction error, optical distortion, die rotation, system precision, system registration, and stage orthogonality of Mann Type 4800DSW TM Wafer Stepper TM systems is explained. Test results for recent instruments are given and compared to the manufacturer's specifications.

Citation Download Citation

William C. Schneider "Testing The Mann Type 4800DSW^TMWafer Steppertm", Proc. SPIE 0174, Developments in Semiconductor Microlithography IV, (17 July 1979); https://doi.org/10.1117/12.957172

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