Automatic Mask Pattern Inspection For Printed Circuits Based On Pattern Width Measurement

Masato Nakashima; Katsumi Fujihara; Takefumi Inagaki

doi:10.1117/12.957370

10 October 1979 Automatic Mask Pattern Inspection For Printed Circuits Based On Pattern Width Measurement

Masato Nakashima, Katsumi Fujihara, Takefumi Inagaki

Proceedings Volume 0182, Imaging Applications for Automated Industrial Inspection and Assembly; (1979) https://doi.org/10.1117/12.957370
Event: Technical Symposium East, 1979, Washington, D.C., United States

Abstract

This is a new mask Inspection technique based on pattern width measurement that can check the fatality of defects. Mask quality depends on pattern width and defects in a fatal area where a normal pattern is seriously damage. In this technique, pattern width measurement and fatal defect detection with a laser beam are used for inspection of masks of PC boards. In order to determine the direction of measurement, diffracted laser light at the pattern edge and spatially divided photodetectors are used. The new inspection system (l) measures pattern width, (2)does not require the original data for comparison, (3)detects fatal defects, (4)has no special alignment and (5)detects defects as small as 10μm can be isolated with 100% accuracy.

Citation Download Citation

Masato Nakashima, Katsumi Fujihara, and Takefumi Inagaki "Automatic Mask Pattern Inspection For Printed Circuits Based On Pattern Width Measurement", Proc. SPIE 0182, Imaging Applications for Automated Industrial Inspection and Assembly, (10 October 1979); https://doi.org/10.1117/12.957370

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