Recent advances in the field of infrared focal planes provide the detector array technology needed to manufacture monolithic and hybrid detector arrays containing large numbers of detectors with buffer amplifiers and multiplexing on a single LSI chip. Infrared focal planes of the future will require the integration of these detector/multiplexer arrays together with support electronics into a manufacturable, testable, reliable, and maintainable IFPA. The IFPA must efficiently interface with cryogenic systems, optics, mechanical structures, and signal processing electronics. Hughes Aircraft Company has conducted a study to determine what technologies are needed to support the assembly of large infrared focal planes. This paper discusses the results of this IFPA study and the progress being made in developing such technologies. Cyrogenic chip carriers, high-density electrical interconnects, multilayered electrical interconnects, and high-density cables are discussed in terms of an architectural approach as it relates to the manufacture, test, and assembly of IFPAs. An integrated focal plane array design is presented to exemplify the validity of this IFPA design approach. The example IFPA design includes, identification of critical test methodologies, assembly techniques, and electrical interconnect requirements that will challenge the state of the art of focal plane assembly and manufacture. Large IFPAs of the next decade will pose new challenges in focal plane architecture, cryogenic high-density cables, and electrical interconnects as well as in cryogenic thermal design and test. This paper presents a modular IFPA design approach that provides solutions to these challenges.