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7 May 1980 Large Time Delay And Integration (TDI) Focal Plane Assembly With An Optically Contiguous Pixel Format
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Proceedings Volume 0217, Advances in Focal Plane Technology; (1980)
Event: 1980 Los Angeles Technical Symposium, 1980, Los Angeles, United States
A 6144 X 64 pixel focal plane assembly has been constructed incorporating six 1024 X 64 Time Delay and Integration Charge-Coupled Devices (TDI CCDs) in a beam-sharer configuration. The beam-sharer approaches 100 percent efficiency over the format, compared to a maximum 50 percent efficiency for a conventional beam-splitter configuration. The TDI CCDs have 20 X 20 micrometer pixels. The focal plane assembly is constructed so that the pixels are contiguous at the optical "butt" between chips to within 2 micrometers and straight within a 6 micrometer error band over the entire six chip length. These dimensional accuracies were achieved using a precision alignment apparatus developed for this purpose. In a way similar to a comparator microscope, its optical system provides simultaneous overlapping fields of view; one incorporates fixed reference lines while the other contains a view of the CCD chips. A mechanical micro-manipulator is used to provide precise control of chip motion in three degrees of freedom (x, y, 0) for each of the two CCD mounting planes. The modular focal plane assembly technique makes practical the fabrication of large-format, gapless configurations of high optical efficiency. Both the assembly technique and methodology of subsequent repair (replacement of chips after some period of service, should that ever be required) are described in detail.
© (1980) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Henry Sadowski and William Dugger "Large Time Delay And Integration (TDI) Focal Plane Assembly With An Optically Contiguous Pixel Format", Proc. SPIE 0217, Advances in Focal Plane Technology, (7 May 1980);

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