28 May 1980 Infrared Testing Of Printed Circuit Boards And Hybrids
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Proceedings Volume 0220, Optics in Metrology and Quality Assurance; (1980) https://doi.org/10.1117/12.958589
Event: 1980 Los Angeles Technical Symposium, 1980, Los Angeles, United States
A system was developed as part of a MICOM Manufacturing Methods and Technology (MM&T) contract to demonstrate the applicability of thermal scanning to testing electronic circuit boards and hybrid circuits on the production line. This paper presents a description of the test equipment outlining its hardware, software, test methodology, applications, capabilities, and limitations, and gives a summary of test results. A short discussion of the probable future of thermal scanning as an electronics test method for printed circuit boards and hybrids is also included.
© (1980) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
M. P. Wirick, H. A. Diede, "Infrared Testing Of Printed Circuit Boards And Hybrids", Proc. SPIE 0220, Optics in Metrology and Quality Assurance, (28 May 1980); doi: 10.1117/12.958589; https://doi.org/10.1117/12.958589

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