28 May 1980 Infrared Testing Of Printed Circuit Boards And Hybrids
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Proceedings Volume 0220, Optics in Metrology and Quality Assurance; (1980) https://doi.org/10.1117/12.958589
Event: 1980 Los Angeles Technical Symposium, 1980, Los Angeles, United States
A system was developed as part of a MICOM Manufacturing Methods and Technology (MM&T) contract to demonstrate the applicability of thermal scanning to testing electronic circuit boards and hybrid circuits on the production line. This paper presents a description of the test equipment outlining its hardware, software, test methodology, applications, capabilities, and limitations, and gives a summary of test results. A short discussion of the probable future of thermal scanning as an electronics test method for printed circuit boards and hybrids is also included.
© (1980) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
M. P. Wirick, M. P. Wirick, H. A. Diede, H. A. Diede, } "Infrared Testing Of Printed Circuit Boards And Hybrids", Proc. SPIE 0220, Optics in Metrology and Quality Assurance, (28 May 1980); doi: 10.1117/12.958589; https://doi.org/10.1117/12.958589

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