Intermachine Registration Errors of Wafer Step-and-Repeat Systems

William C. Schneider

doi:10.1117/12.958620

5 September 1980 Intermachine Registration Errors of Wafer Step-and-Repeat Systems

William C. Schneider

Proceedings Volume 0221, Developments in Semiconductor Microlithography V; (1980) https://doi.org/10.1117/12.958620
Event: Semiconductor Microlithography V, 1980, San Jose, United States

Abstract

This paper discusses the sources of intermachine registration errors of wafer step-and-repeat systems. The vernier overlay techniques used by GCA/Burlington to measure intermachine registration of the Mann Type 4800 DSW^TM Wafer Stepper^TM are fully described. Results are given for a number of intermachine comparisons. The use of similar vernier overlay methods to determine the intermachine registration errors between step-and-repeat systems and full field projection mask aligners is also discussed.

Citation Download Citation

William C. Schneider "Intermachine Registration Errors of Wafer Step-and-Repeat Systems", Proc. SPIE 0221, Developments in Semiconductor Microlithography V, (5 September 1980); https://doi.org/10.1117/12.958620

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