5 September 1980 Intermachine Registration Errors of Wafer Step-and-Repeat Systems
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Proceedings Volume 0221, Developments in Semiconductor Microlithography V; (1980); doi: 10.1117/12.958620
Event: Semiconductor Microlithography V, 1980, San Jose, United States
Abstract
This paper discusses the sources of intermachine registration errors of wafer step-and-repeat systems. The vernier overlay techniques used by GCA/Burlington to measure intermachine registration of the Mann Type 4800 DSWTM Wafer StepperTM are fully described. Results are given for a number of intermachine comparisons. The use of similar vernier overlay methods to determine the intermachine registration errors between step-and-repeat systems and full field projection mask aligners is also discussed.
© (1980) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
William C. Schneider, "Intermachine Registration Errors of Wafer Step-and-Repeat Systems", Proc. SPIE 0221, Developments in Semiconductor Microlithography V, (5 September 1980); doi: 10.1117/12.958620; https://doi.org/10.1117/12.958620
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KEYWORDS
Semiconducting wafers

Reticles

Tolerancing

Image registration

Overlay metrology

Semiconductors

Optical lithography

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