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5 September 1980 Registration And Wafer Distortion In The Production Environment
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Production of MOS/LSI circuits with minimum design rule dimensions of 4-6 microns without complete self-aligning features has provided the opportunity to study several aspects of mask to wafer registration. The mask working tools and wafers can be major contributors to misregistration. Detailed measurements and analysis are presented to illuminate the contribution of mask substrate material and wafer physical characteristics (surface, texture, thickness, crystal type, crystal defects) to misregistration. Conclusions are drawn with regard to the practical solution to misregistration in the production environment. Low expansion substrates for masks and thick (20 mil) wafers provide adequate dimensional control for registration.
© (1980) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
J. Hester, C. Vesper, R . Cody, and J E. Martin "Registration And Wafer Distortion In The Production Environment", Proc. SPIE 0221, Developments in Semiconductor Microlithography V, (5 September 1980);


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