5 September 1980 Ultrathick Photoresist Processing
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Proceedings Volume 0221, Developments in Semiconductor Microlithography V; (1980); doi: 10.1117/12.958626
Event: Semiconductor Microlithography V, 1980, San Jose, United States
Abstract
Diazo-type positive photoresists are commonly used for pattern replication by the integrated circuit industry in a thickness range ≈ O.3-3μm. We are using these same resists at thicknesses as great as 40 μm to form electroplating molds for the fabrication of micro-Fresnel zone plates. Difficulties are encountered when films thicker than l5-18μm are used for pattern replication. Most significant of these difficulties are: i) the occurance of bulk microfractures throughout the resist volume, ii) loss of UV sensitivity, and iii) sidewall taper in high aspect ratio structures. These difficulties, with the exception of the sidewall taper, can be overcome with appropriate resist processing schedules.
© (1980) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
D . R . Ciarlo, N . M. Ceglio, "Ultrathick Photoresist Processing", Proc. SPIE 0221, Developments in Semiconductor Microlithography V, (5 September 1980); doi: 10.1117/12.958626; https://doi.org/10.1117/12.958626
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KEYWORDS
Photoresist materials

Ultraviolet radiation

Zone plates

Photoresist developing

Gold

Humidity

Photoresist processing

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