31 October 1980 Die Board Cutting by CO2 Laser
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Proceedings Volume 0247, Advances in Laser Engineering and Applications; (1980); doi: 10.1117/12.959373
Event: 24th Annual Technical Symposium, 1980, San Diego, United States
Abstract
The conventional method of dieboard manufacture is described and compared with the laser dieboard process. Consideration is given to savings achievable as a result of the precision die produced by laser cutting in combination with numerical control. The development of machines is briefly discussed and modern laser die-board cutters are described. Some points on laser job shops are also covered.
© (1980) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Neil Forbes, "Die Board Cutting by CO2 Laser", Proc. SPIE 0247, Advances in Laser Engineering and Applications, (31 October 1980); doi: 10.1117/12.959373; https://doi.org/10.1117/12.959373
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KEYWORDS
Laser cutting

Manufacturing

Carbon dioxide lasers

Laser processing

Laser engineering

Computer programming

Laser applications

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