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17 December 1980 Laminated Mosaic Module Performance Measurements
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Laminated mosaic modules, a z-technology are introduced as an alternative architectural configuration for mosaic sensor focal plane applications. The module features a 4096 element (8x512) PbS array with 64 thirty-two input signal processing chips. Modules can be stacked into subarrays without a composite array fill factor loss. Measurements and results confirm the performance status of this technology development approach. Module components are discussed first followed by the module assembly and the subarray (a four module stack).
© (1980) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Gary L. Payton, Larry G. Pfaffly, and William R. Reitman "Laminated Mosaic Module Performance Measurements", Proc. SPIE 0253, Modern Utilization of Infrared Technology VI, (17 December 1980);


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