Processing Of Deep-Ultraviolet (UV) Resists

Pieter van Pelt

doi:10.1117/12.931886

28 July 1981 Processing Of Deep-Ultraviolet (UV) Resists

Pieter van Pelt

Proceedings Volume 0275, Semiconductor Microlithography VI; (1981) https://doi.org/10.1117/12.931886
Event: 1981 Microlithography Conferences, 1981, San Jose, United States

Abstract

The degradation of PMMA, irradiated with a Philips deep-UV source, was studied by means of gel permeation chromatography (GPC). A steep increase of the dissolution rate in MIBK was found with only a small decrease in molweight. This result supports Ouano's hypothesis of pore formation in PMMA upon E-beam irradiation, due to chemical degradation of the polymer. The sensitivity and contrast value of PMMA and PMIPK was determined, using 1 min. dip development in2MIBK. The minimum deerUV dose (200-300 nm.) needed to clear the film ranged from 750 mJ/cm² for PMMA to 65 mJ/cm² for sensitized PMIPK, with contrast values between 2.5 and 3.7. The plasma etch resistance of PMMA increased five-fold when the resist was mixed with an aromatic polymer, without loss of resolution or contrast. The sensitivity, contrast, resolution and plasma etch resistance of PMIPK based resist could be made as good as or better than that of existing positive photoresists.

Citation Download Citation

Pieter van Pelt "Processing Of Deep-Ultraviolet (UV) Resists", Proc. SPIE 0275, Semiconductor Microlithography VI, (28 July 1981); https://doi.org/10.1117/12.931886

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