28 July 1981 Simple Metal Lift-Off Process For 1 Micron Al/5% Cu Lines
Author Affiliations +
Abstract
Two of the most challenging problems confronting processes aimed at 2μm pitch minimum geometries are: imaging on highly reflective,grainy metals and the subsequent anisotropic plasma etch of aluminum or aluminum alloys. Metal lift off processes can eliminate these difficulties altogether by reversing the normal procedure for metalization. "Metal Lift Off" refers to processes in which the metal or metal alloy layer is deposited over the photoresist image and then the unwanted metal is removed by dissolving away the photoresist and lifting off the excess metal by suitable mechanical means (Fig. 1).
© (1981) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Tom Batchelder, Tom Batchelder, } "Simple Metal Lift-Off Process For 1 Micron Al/5% Cu Lines", Proc. SPIE 0275, Semiconductor Microlithography VI, (28 July 1981); doi: 10.1117/12.931885; https://doi.org/10.1117/12.931885
PROCEEDINGS
7 PAGES


SHARE
Back to Top