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13 September 1982 Mix And Match-10x Reduction Wafer Steppers
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Abstract
The ability to view an area of a wafer and 10X stepper reticle, simultaneously on axis, has been used to match different 10X reduction wafer steppers. This paper defines the problem and discusses test results. Operational parameters, global alignment, and intra-field die alignment are discussed. Wafer distortion and field distortion are examined. Registration data gathered from visual and computer diagnostics, which support the conclusions, are discussed.
© (1982) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Adonis Stephanakis and Harry L. Coleman "Mix And Match-10x Reduction Wafer Steppers", Proc. SPIE 0334, Optical Microlithography I: Technology for the Mid-1980s, (13 September 1982); https://doi.org/10.1117/12.933569
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