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15 October 1982 Method Of Characterizing Wafer Steppers
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Proceedings Volume 0342, Integrated Circuit Metrology I; (1982)
Event: 1982 Technical Symposium East, 1982, Arlington, United States
Characterizing wafer exposure equipment is becoming more important with the increasing use of such equipment. The process of fully characterizing a wafer stepper involves making several hundred measurements to sub-micron tolerances. This paper describes a method of using the automatic reticle-to-wafer aligner to collect the large number of measurements necessary for system characterization. The analysis method involves exposing an array of alignment targets, and then measuring the X-Y coordinates of the targets using the automatic aligner. Using this method, it is possible to obtain precise X-Y coordinate data at the rate of thirty measurements per minute. The coordinate data is recorded on tape cassette and transferred to a desk-top computer for data reduction. The data is analyzed to determine the error contribution of each of a number of systematic error sources. Typical data for a number of systems is presented, and the data reduction method is described. One primary application for this method is to characterize level-dedicated production wafer exposure systems.
© (1982) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Chris Van Peski "Method Of Characterizing Wafer Steppers", Proc. SPIE 0342, Integrated Circuit Metrology I, (15 October 1982);

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