Automatic Testing Of Infrared Components

M. Gurien; J. Rysanek

doi:10.1117/12.934229

12 July 1983 Automatic Testing Of Infrared Components

M. Gurien, J. Rysanek

Proceedings Volume 0366, Modern Utilization of infrared Technology VIII; (1983) https://doi.org/10.1117/12.934229
Event: 26th Annual Technical Symposium, 1982, San Diego, United States

Abstract

This paper discusses the techniques utilized during automated testing of Z-technology modules for mosaic focal planes. The testing includes continuity and isolation resistance measurements on both layers and modules, and functional tests of the Signal Processing Chips as they are wirebonded to the modules. The criteria for layer selection, empirically derived, is presented. Test results are presented and their impact on product development are described.

Citation Download Citation

M. Gurien and J. Rysanek "Automatic Testing Of Infrared Components", Proc. SPIE 0366, Modern Utilization of infrared Technology VIII, (12 July 1983); https://doi.org/10.1117/12.934229

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