10 August 1983 Automatic Visual Inspection Applied To Silicon Chip Packaging
Author Affiliations +
Proceedings Volume 0376, Optical Sensing: Techniques, Benefits, Costs; (1983) https://doi.org/10.1117/12.934733
Event: Optical Sensing Techniques, Benefits, Costs, 1982, Taddington, United Kingdom
This paper discusses the architecture and algorithms of an image processing system designed to precisely locate and inspect silicon dice and thus guide a pick and place mechanism in an automatic chip packaging system. The CRS1000 image processing system uses a Motorola 68000 microprocessor in a flexible bus-oriented architecture which provides for the addition of high-speed hardware processors. Transformation of the image into an edge map allows the position and orientation of the die to be reliably and accurately measured.
© (1983) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
W. G. L. Adaway, W. G. L. Adaway, } "Automatic Visual Inspection Applied To Silicon Chip Packaging", Proc. SPIE 0376, Optical Sensing: Techniques, Benefits, Costs, (10 August 1983); doi: 10.1117/12.934733; https://doi.org/10.1117/12.934733

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