9 August 1983 Maskless Laser Plating Techniques For Microelectronic Materials
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Proceedings Volume 0385, Laser Processing of Semiconductor Devices; (1983) https://doi.org/10.1117/12.934964
Event: 1983 Los Angeles Technical Symposium, 1983, Los Angeles, United States
Abstract
We describe techniques for laser enhanced plating of gold, nickel and copper. This maskless plating results in speeds up to 103 times that of conventional plating. Mechanisms and applications are discussed.
© (1983) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
R. J. von Gutfeld, M. H. Gelchinski, L. T. Romankiw, "Maskless Laser Plating Techniques For Microelectronic Materials", Proc. SPIE 0385, Laser Processing of Semiconductor Devices, (9 August 1983); doi: 10.1117/12.934964; https://doi.org/10.1117/12.934964
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