3 October 1983 3-D Profile Detection Of Etched Patterns Using A Laser Scanner (3D-SCAN DETECTION) For Automatic Inspection Of Printed Circuit Boards
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Proceedings Volume 0389, Optical Systems Engineering III; (1983) https://doi.org/10.1117/12.935024
Event: 1983 Los Angeles Technical Symposium, 1983, Los Angeles, United States
Abstract
A new detection method named 3D-SCAN DETECTION has been developed. The method can detect three dimensional profiles of etched pattern on an inner layer of multilayer printed circuit boards (PC boards). In this system, one scanning of a laser beam allows the simultaneous detection of both top and bottom widths of an etched pattern (standard width and thickness: 100 x 35 μm) to within an accuracy of 10 pm. A prototype of 3D-SCAN DETECTION has been experimentally confirmed to have sufficient performance for the detection of such flaws as nicks in a copper pattern and poor spacing between adjacent conductors.
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Moritoshi Ando, Moritoshi Ando, Kikuo Mita, Kikuo Mita, Yoshikazu Kakinoki, Yoshikazu Kakinoki, Takefumi Inagaki, Takefumi Inagaki, } "3-D Profile Detection Of Etched Patterns Using A Laser Scanner (3D-SCAN DETECTION) For Automatic Inspection Of Printed Circuit Boards", Proc. SPIE 0389, Optical Systems Engineering III, (3 October 1983); doi: 10.1117/12.935024; https://doi.org/10.1117/12.935024
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