Automatic Circuit Card Inspection

Ronald B. Sartain; Francis X. Jeskie

doi:10.1117/12.935027

3 October 1983 Automatic Circuit Card Inspection

Ronald B. Sartain, Francis X. Jeskie

Proceedings Volume 0389, Optical Systems Engineering III; (1983) https://doi.org/10.1117/12.935027
Event: 1983 Los Angeles Technical Symposium, 1983, Los Angeles, United States

Abstract

This paper describes two automated electro-optical stations that perform realtime inspection of printed wiring boards (PWBs) in a manufacturing environment. Each station uses significant-feature extraction as a non-reference form of digital image processing to eval-uate PWB adherence to prescribed tolerances, and each station will determine the significant defects that exist on a manufactured PWB. One station will be dedicated to the evaluation of defects present on detail or unpopulated boards, inner layers, and artwork; a second station will inspect the solder integrity of populated PWBs. Both stations use a CCD camera with a 480 x 388 element format and zoom optics to view a PWB in both local and global viewing aspects. Board acceptability will depend on criteria established by MIL and quality control standards and by design requirements. This paper discusses the general design of each station, including illumination conditions, station control, and PWB handling. Image processing considerations and manufacturing limitations are highlighted, and this paper outlines the use of an electro-optical station simulator for algorithm development and station design.

Citation Download Citation

Ronald B. Sartain and Francis X. Jeskie "Automatic Circuit Card Inspection", Proc. SPIE 0389, Optical Systems Engineering III, (3 October 1983); https://doi.org/10.1117/12.935027

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