Automatic Wafer Inspection

K. Harris; P. Sandland; R. Singleton

doi:10.1117/12.935145

7 November 1983 Automatic Wafer Inspection

K. Harris, P. Sandland, R. Singleton

Proceedings Volume 0394, Optical Microlithography II: Technology for the 1980s; (1983) https://doi.org/10.1117/12.935145
Event: 1983 Microlithography Conferences, 1983, Santa Clara, United States

Abstract

There is a need for micro-pattern inspection of in-process wafers in order to monitor the ongoing pattern quality. In the context of volume wafer production, this need is currently being addressed by a variety of manual and semiautomated equipment. There is a continuing trend towards automation. A profile of current needs and practices, as well as possible future solutions, to pattern inspection and measurement has been developed after consulting with numerous individuals in the industry. Needs that will develop in the near future and some possible solutions are considered. Computer Aided Processing in the photo area is discussed. Pattern recognition is discussed as the inspection technology of the future and some results are shown.

Citation Download Citation

K. Harris, P. Sandland, and R. Singleton "Automatic Wafer Inspection", Proc. SPIE 0394, Optical Microlithography II: Technology for the 1980s, (7 November 1983); https://doi.org/10.1117/12.935145

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