VLSI Lithography Using Canon 1:1 Wafer Stepper

Venkat Nagaswami; Gail Ungemach; Wayne Hsueh; Murray Trudel

doi:10.1117/12.935127

7 November 1983 VLSI Lithography Using Canon 1:1 Wafer Stepper

Venkat Nagaswami, Gail Ungemach, Wayne Hsueh, Murray Trudel

Proceedings Volume 0394, Optical Microlithography II: Technology for the 1980s; (1983) https://doi.org/10.1117/12.935127
Event: 1983 Microlithography Conferences, 1983, Santa Clara, United States

Abstract

Although wafer stepper technology seems to be the general trend in fabrication of VLSI circuits, the semiconductor industry is still evaluating the relative merits of 1X, 5X and 10X magnification. Field-proven early model reduction steppers are now being challenged by new lower-cost 1:1 steppers with comparable specifications, such as the Canon FPA-112FA. The present study takes a close look at the Canon FPA-112FA 1:1 wafer stepper as a production viable VLSI tool. Results obtained in processing a 2-poly NMOS process (1.7 micron minimum space) are presented.

Citation Download Citation

Venkat Nagaswami, Gail Ungemach, Wayne Hsueh, and Murray Trudel "VLSI Lithography Using Canon 1:1 Wafer Stepper", Proc. SPIE 0394, Optical Microlithography II: Technology for the 1980s, (7 November 1983); https://doi.org/10.1117/12.935127

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