19 January 1984 Infrared Imaging Techniques To Determine The Bond Integrity In High Density Lap Soldered Printed Circuit Boards
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Abstract
As the electronics world continues to increase in complexity, yet demanding reduced size and higher reliability, the problem of product assurance becomes more difficult. Inspection techniques must keep pace. To accomplish this, infrared techniques have been applied to the non-destructive analysis of high density, multi-layer printed circuit boards and in particular the area regarding the integrity of lap solder bonds. An 8 - 13 micron infrared scanner was used to observe the circuit boards while heat was flowing through the bonds under test. The general procedure was to actively apply heat or cold in some way to the component or to the circuit board and observe the rate of heat flow through the bonded leads. Fast flow indicated a good bond while slow flow a poor bond. All the leads to one component could be done at one glance. Although emissivity variations both from the material's differences and shape presented some problems, five different infrared techniques proved successful as applicable for NDT tests.
© (1984) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
R. Paulson, R. Paulson, H. Decker, H. Decker, J. Hodor, J. Hodor, J. Barney, J. Barney, T. Schapp, T. Schapp, } "Infrared Imaging Techniques To Determine The Bond Integrity In High Density Lap Soldered Printed Circuit Boards", Proc. SPIE 0430, Infrared Technology IX, (19 January 1984); doi: 10.1117/12.936396; https://doi.org/10.1117/12.936396
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