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29 June 1984 How Process Technology Can Make Submicron Photolithography Easier : Some Practical Examples.
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Abstract
For photolithography to become a technique enabling the submicron field to be reached, research work on resist exposure tools and principles is not in itself sufficient. It is also necessary to try to use all the possibilities offered by technological procedures such as coating and dry etching to the full. It is for this reason that we have been led to develop recent microlithography techniques using plasma etching to condition the substrate flatness as well as the etching profiles, and similarly to transfer fine geometries with accurate dimensional control. In this paper, we will present sloping wall etching, planarization and spacer production techniques.
© (1984) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
F Buiguez, J P Lazzari, E Tabouret, and M. Thouy "How Process Technology Can Make Submicron Photolithography Easier : Some Practical Examples.", Proc. SPIE 0470, Optical Microlithography III: Technology for the Next Decade, (29 June 1984); https://doi.org/10.1117/12.941880
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