29 June 1984 Implementation Of Automatic Alignment Utilizing Electrical Wafer Probe Techniques
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Abstract
Automatic alignment has been offered by most manufacturers of alignment tools in recent years, and is regarded as essential in acheiving the overlay accuracy required to produce the current generation of fine-line integrated circuits. However, problems associated with the automatic alignment technologies themselves can offset the gains achieved and can, in worst case, actually degrade overall registration performance. Two important problems which must be overcome are: Autoalignment offsets which can cause alignment accuracy to deviate by more than a micron, even though precision is quarter micron or better. 2. Process-dependent variations- causing changes in the topographical and optical characteristics of the alignment keys which can change or degrade the signal produced by the key.
© (1984) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Robert R. Alien, Myron Cagan, Marti Foster, Talat Hasan, "Implementation Of Automatic Alignment Utilizing Electrical Wafer Probe Techniques", Proc. SPIE 0470, Optical Microlithography III: Technology for the Next Decade, (29 June 1984); doi: 10.1117/12.941899; https://doi.org/10.1117/12.941899
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