18 June 1984 Automatic X-Ray Alignment System For Submicron VLSI Printing
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Abstract
An automatic, tri-field registration system is described, as used in an automatic wafer exposure system2, for wafers up to 100 mm diameter featuring a high power stationary anode X-ray source (Pd target). The system provides automatic registration and run out compensation based upon the use of Fresnel zone plate alignment targets. First, the basic concepts of the alignment method using circular Fresnel zone plates are presented. The complete alignment system is then described including machine hardware, software, and system operation. Finally, system results of overlay performance obtained with the registration system are given.
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B Fay, B Fay, W T Novak, W T Novak, I Carlsson, I Carlsson, } "Automatic X-Ray Alignment System For Submicron VLSI Printing", Proc. SPIE 0471, Electron-Beam, X-Ray, and Ion-Beam Techniques for Submicrometer Lithographies III, (18 June 1984); doi: 10.1117/12.942331; https://doi.org/10.1117/12.942331
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