Noncontact Optical Measuring Methods Of Silicon Wafer Deformation

L. Kocsanyi; J. Giber

doi:10.1117/12.942410

18 January 1985 Noncontact Optical Measuring Methods Of Silicon Wafer Deformation

L. Kocsanyi, J. Giber

Proceedings Volume 0473, Symposium Optika '84; (1985) https://doi.org/10.1117/12.942410
Event: Symposium Optika '84, 1984, Budapest, Hungary

Abstract

Deformation measuring methods of 2", 3" diameter silicon wafers are presented. Michelson interferometer and moire method were used to determine flatness of the wafers. An in-situ interferometric measuring system was developed to measure continuously the deformation changes of a wafer during heat treatment.

Citation Download Citation

L. Kocsanyi and J. Giber "Noncontact Optical Measuring Methods Of Silicon Wafer Deformation", Proc. SPIE 0473, Symposium Optika '84, (18 January 1985); https://doi.org/10.1117/12.942410

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