3 September 1985 Surface Quality Requirements And Inspection Techniques For Semiconductor Slices
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Proceedings Volume 0525, Measurement and Effects of Surface Defects & Quality of Polish; (1985) https://doi.org/10.1117/12.946351
Event: 1985 Los Angeles Technical Symposium, 1985, Los Angeles, United States
Abstract
Modern semiconductor device technology imposes increasing demands on the surface perfection of polished and epitaxial silicon slices. These requirements along with the need for statistical process control call for improved objective, automated and quantifiable inspection techniques. An overview is given over various imperfections of polished and epitaxial silicon slices. Current prevailant inspection techniques are discussed with emphasis on their shortcomings regarding the above mentioned requirements.
© (1985) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Detlef Reimann, Detlef Reimann, } "Surface Quality Requirements And Inspection Techniques For Semiconductor Slices", Proc. SPIE 0525, Measurement and Effects of Surface Defects & Quality of Polish, (3 September 1985); doi: 10.1117/12.946351; https://doi.org/10.1117/12.946351
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