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23 July 1985 Double Telecentric Wafer Stepper Using Laser Scanning Method
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Abstract
A stepper of new concept has been developed. It uses double telecentric lens and TTL laser scanning method. It is TTL on axis stepper in the ture sense, because alignment is checked directly before exposure. The projection optics can resolve 1.0 μm in production and has small distortion. The alignment accuracy within 0.25 μm ( 3 o) is achieved.
© (1985) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Akiyoshi Suzuki "Double Telecentric Wafer Stepper Using Laser Scanning Method", Proc. SPIE 0538, Optical Microlithography IV, (23 July 1985); https://doi.org/10.1117/12.947740
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