Mixing 1X Scanning And 5X Step-And-Repeat Exposure Systems In A Semiconductor Processing Line

W. Carpenter; J. LaRue; R. Chappelow

doi:10.1117/12.947745

23 July 1985 Mixing 1X Scanning And 5X Step-And-Repeat Exposure Systems In A Semiconductor Processing Line

W. Carpenter, J. LaRue, R. Chappelow

Proceedings Volume 0538, Optical Microlithography IV; (1985) https://doi.org/10.1117/12.947745
Event: 1985 Microlithography Conferences, 1985, Santa Clara, United States

Abstract

VLSI products require extremes in lithographic capabilities. Several masking levels typically demand leading-edge lithographic capabilities, while a number of other levels typically have less stringent requirements (approximately 5pm). Similar statements may be made regarding typical overlay requirements. This leads to the consideration of mixing 1X aligners with step-and-repeat 5X reduction systems. The objective of this procedure is to minimize costs and meet lithographic requirements with increased real-time throughput. There are three key issues to be dealt with: 1) Mixed tool set overlay, 2) Relative process/tool cost considerations, 3) Logistics of line operation. This paper describes mixed-tool set overlay results and a description of the techniques used to minimize them.

Citation Download Citation

W. Carpenter, J. LaRue, and R. Chappelow "Mixing 1X Scanning And 5X Step-And-Repeat Exposure Systems In A Semiconductor Processing Line", Proc. SPIE 0538, Optical Microlithography IV, (23 July 1985); https://doi.org/10.1117/12.947745

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