19 December 1985 An Automatic Visual Alignment and Inspection Station for Tape Automated Bonding (TAB) Products
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Abstract
In addition to reviewing the major alignment and inspection procedures in producing miniaturized electronic components, this paper describes a 3D automated vision system used in the inspection of TAB (Tape Automated Bonding) products. This multi-sensor system utilizing four solid-state cameras is aliased IBIS Intelligent Bump-tape Inspection System. Besides the capabilities to measure the major planar geometric features, the key features of this system include (1) structured-light 31) vision for etch depth measurement, (2) data-base driven inspection, (3) close coupling of microsensing and micropositioning, (4) sequential usage of multiple resolution cameras and computer controlled illumination for optimal micromeasurements, and ( 5 ) statistical analysis of measured data for process trend monitoring.
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Gerald J . Gleason, Tom Pandolfi, Russell R. Ames, Michael J Chen, "An Automatic Visual Alignment and Inspection Station for Tape Automated Bonding (TAB) Products", Proc. SPIE 0557, Automatic Inspection and Measurement, (19 December 1985); doi: 10.1117/12.966257; https://doi.org/10.1117/12.966257
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