Paper
2 January 1986 Focused-Beam Vs. Conventional Bright-Field Scanning Microscopy For Integrated Circuit Metrology
D. Nyyssonen
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Abstract
Current optical instrumentation being developed for critical dimension measurements in the integrated circuit industry is following one of two very different optical designs, i.e., either a focused laser beam which scans the wafer or the more conventional bright-field microscope. Traditional optical design lore has described these systems as "equivalent" based on the principle of reciprocity. More recent research has shown"- that the responses of these two types of systems are not equivalent for imaging of structures patterned in thin films such as those found in integrated circuit wafer fabrication. This lack of reciprocity is the result of the dependence of the diffraction pattern on the angle of incidence of the illumination. The impact of the lack of reciprocity on the design and calibration of critical dimension measurement systems is discussed.
© (1986) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
D. Nyyssonen "Focused-Beam Vs. Conventional Bright-Field Scanning Microscopy For Integrated Circuit Metrology", Proc. SPIE 0565, Micron and Submicron Integrated Circuit Metrology, (2 January 1986); https://doi.org/10.1117/12.949739
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Cited by 2 scholarly publications.
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KEYWORDS
Diffraction

Semiconducting wafers

Integrated circuits

Laser systems engineering

Imaging systems

Optical scanning systems

Sensors

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