28 March 1986 Void Detection In Metals Using Heat Flow Parallel To The Target Surface
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Proceedings Volume 0581, Thermosense VIII: Thermal Infrared Sensing for Diagnostics and Control; (1986); doi: 10.1117/12.950880
Event: 1985 Cambridge Symposium, 1985, Cambridge, United States
Abstract
This paper discusses a new technique to locate voids in high conductivity materials such as metals. Heat is applied parallel to the target surface (perpendicular to viewing direction). A thermal contour display (produced by a thermal imaging system) of the material under test shows a distinct "pinch" produced by a void. This thermal pinch is persistent and is not always destroyed by high lateral conductivity. This new technique promises to open a whole new realm of thermographic applications.
© (1986) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
G. L. Orlove, R. P. Madding, C. P. Burger, B. Raj, "Void Detection In Metals Using Heat Flow Parallel To The Target Surface", Proc. SPIE 0581, Thermosense VIII: Thermal Infrared Sensing for Diagnostics and Control, (28 March 1986); doi: 10.1117/12.950880; http://dx.doi.org/10.1117/12.950880
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KEYWORDS
Metals

Thermography

Imaging systems

Aluminum

Infrared imaging

Target detection

Mechanics

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