Translator Disclaimer
7 July 1986 Functional Laser Trimming: An Overview
Author Affiliations +
Proceedings Volume 0611, Laser Processing of Semiconductors & Hybrids; (1986) https://doi.org/10.1117/12.956407
Event: O-E/LASE'86 Symposium, 1986, Los Angeles, CA, United States
Abstract
Laser trimming of hybrid circuits, and more recently, monolithic IC's is often used to improve yields and/or device performance. As device technology advances, trim technology continues to evolve and now offers spot sizes under 4μm, positioning accuracy to lμm, positioning speed of a few ros, and field coverage of up to 8 inches; addressing such diverse applications as VLSI memory repair, and complete PC board assembly trimming. Increased automation in the form of fully automatic device loading, alignment and beam focus are resulting in vastly improved thruput and lowered manufacturing costs. New, faster, and more accurate instrumentation is being introduced to trim the new mixed digital/linear parts beyond the traditional restriction to simple passive resistance and functional DC trimming. Furthermore, trimmable device design has emerged from the "black art" catagory and predictable results can now be achieved. However, gaining familiarity with all aspects of functional trimming is a formidable task and this is a major reason more manufacturers haven't added laser trimming to their bag of tricks.
© (1986) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Richard H. Wagner "Functional Laser Trimming: An Overview", Proc. SPIE 0611, Laser Processing of Semiconductors & Hybrids, (7 July 1986); https://doi.org/10.1117/12.956407
PROCEEDINGS
10 PAGES


SHARE
Advertisement
Advertisement
Back to Top