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7 July 1986 Functional Laser Trimming Of Thin Film Resistors On Silicon ICs
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Proceedings Volume 0611, Laser Processing of Semiconductors & Hybrids; (1986)
Event: O-E/LASE'86 Symposium, 1986, Los Angeles, CA, United States
Modern Laser Wafer Trimming (LWT) technology achieves exceptional analog circuit performance and precision while maintain-ing the advantages of high production throughput and yield. Microprocessor-driven instrumentation has both emphasized the role of data conversion circuits and demanded sophisticated signal conditioning functions. Advanced analog semiconductor circuits with bandwidths over 1 GHz, and high precision, trimmable, thin-film resistors meet many of todays emerging circuit requirements. Critical to meeting these requirements are optimum choices of laser characteristics, proper materials, trimming process control, accurate modeling of trimmed resistor performance, and appropriate circuit design. Once limited exclusively to hand-crafted, custom integrated circuits, designs are now available in semi-custom circuit configurations. These are similar to those provided for digital designs and supported by computer-aided design (CAD) tools. Integrated with fully automated measurement and trimming systems, these quality circuits can now be produced in quantity to meet the requirements of communications, instrumentation, and signal processing markets.
© (1986) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Michael J. Mueller and Wes Mickanin "Functional Laser Trimming Of Thin Film Resistors On Silicon ICs", Proc. SPIE 0611, Laser Processing of Semiconductors & Hybrids, (7 July 1986);

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