Thick coatings (5-15μm) of a new dual image, aqueous developable photoresist can be exposed using a light attenuating photomask consisting of clear, opaque and grey areas and then processed to yield thermally stable 3-dimensional structures which are potentially useful as mechanical and optical components of devices. In the positive mode, relief and intaglio images are produced by processing similar to positive novolak based resists with 1- 2μm resolution and with the added feature that the images can be made thermally stable to temperatures >300° C. Negative mode processing of coated wafers imaged with the special mask produces thermally stable structures with tunnels or hollow chambers as well as cantilever beams. Because these structures are crosslinked at the time of development, processing in the negative mode shows much wider latitude than is the case in the positive mode. Images by negative mode processing are capable of submicron resolution, higher aspect ratio (>3 vs <1.6), and inward sloping wall profiles adjustable by exposure. The acid hardening resin compositions cover a broad range of compositions so that resins can be tailored to meet specific property requirements.