9 July 1986 Optimized Material For Bottom Layer Of Trilevel Resist System
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Requirements for the bottom layer of the trilevel resist system are examined with the aid of the SAMPLE simulator. Some conventional positive photoresists and our new bottom layer material RG-3900B are evaluated as a bottom layer. RG-3900B is a phenolic resin mixed with a novel azide compound. It is found that RG-3900B has the following excellent optical properties with relatively short baking time at about 200°C; it strongly absorbs the exposing light and is transparent at visible regions for alignment. Therefore, when applied as a bottom layer, it minimizes linewidth variations on highly reflective substrate topography without degradation of alignment accuracy. RG-3900B has been successfully applied to our various devices with multilevel metalization to obtain fine patterns.
© (1986) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Noboru Moriuchi, Noboru Moriuchi, Seiichiro Shirai, Seiichiro Shirai, Takao Iwayanagi, Takao Iwayanagi, } "Optimized Material For Bottom Layer Of Trilevel Resist System", Proc. SPIE 0631, Advances in Resist Technology and Processing III, (9 July 1986); doi: 10.1117/12.963655; https://doi.org/10.1117/12.963655


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