Paper
30 June 1986 Advanced X-Ray Alignment System
B. S. Fay, W. T. Novak
Author Affiliations +
Abstract
Step and repeat X-ray lithography is essential for achieving the fine lines, accurate registration, and extreme density required to produce the next generation of very large scale integrated circuits. Drawing upon its own experience in developing a full-field X-ray lithography system [1], as well as upon technology developed at companies such as Thomson-CSF [2] and AT&T [3], Micronix Corporation in Los Gatos, California, is introducing such a system, called the MX-1600.
© (1986) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
B. S. Fay and W. T. Novak "Advanced X-Ray Alignment System", Proc. SPIE 0632, Electron-Beam, X-Ray, and Ion-Beam Technology for Submicrometer Lithographies V, (30 June 1986); https://doi.org/10.1117/12.963679
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CITATIONS
Cited by 2 scholarly publications and 2 patents.
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KEYWORDS
Photomasks

Semiconducting wafers

Optical alignment

X-rays

Wafer-level optics

Distortion

X-ray lithography

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