20 August 1986 A Simple Method To Determine Alignment Tolerance In Photolithography Process
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Abstract
For a device manufacturer, lithography alignment tolerance vs die yield is of major concern. Often device designers will be working off a set of design rules, but the practical are not able to provide such information ahead of time. It is often necessary to obtain it through correlation of alignment keys and end product yields. How accurate these scribe grid keys correlate with the actual circuit yield can make this issue confusing. A new concept of generating this information from die yields has been evaluated with quite promising results.
© (1986) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Wei Wu, Wei Wu, Sunny Cheng, Sunny Cheng, } "A Simple Method To Determine Alignment Tolerance In Photolithography Process", Proc. SPIE 0633, Optical Microlithography V, (20 August 1986); doi: 10.1117/12.963707; https://doi.org/10.1117/12.963707
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