Printed Circuit Board Fault Detection And Isolation Using Thermal Imaging Techniques

Keith V. Pearson

doi:10.1117/12.964207

5 August 1986 Printed Circuit Board Fault Detection And Isolation Using Thermal Imaging Techniques

Keith V. Pearson

Proceedings Volume 0636, Thermal Imaging; (1986) https://doi.org/10.1117/12.964207
Event: 1986 Technical Symposium Southeast, 1986, Orlando, United States

Abstract

Equipment description and preminary results of the field evaluation of an Automatic Infrared Test and Inspection System (AITIS) developed under a U.S. Air Force Manufacturing Technology contract sponsored by the Air Force Wright Aeronautical Laboratories are presented. The AITIS equipment can be used in repair depots and in circuit board manufacturing production facilities to test printed circuit board assemblies to detect and isolate circuit faults to the componment level through a noncontact infrared screening process.

Citation Download Citation

Keith V. Pearson "Printed Circuit Board Fault Detection And Isolation Using Thermal Imaging Techniques", Proc. SPIE 0636, Thermal Imaging, (5 August 1986); https://doi.org/10.1117/12.964207

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