15 January 1988 Laser Holographic Inspection Of Solder Joints On Printed Circuit Board (PCB)
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Proceedings Volume 0673, Holography Applications; (1988); doi: 10.1117/12.939057
Event: Holography Applications, 1986, Beijing, China
Abstract
The principle of inspecting solder joints by holographic interferometric technique is introduced. The criterion of discriminating the flaws is suggested. The results are given and testified by metallographical sectioning.
© (1988) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Hong Jing, Geng Wanzhen, Jiang Lingzhen, Xue Wei, Ma Jing, Zhao Shijie, Yang Jingfeng, "Laser Holographic Inspection Of Solder Joints On Printed Circuit Board (PCB)", Proc. SPIE 0673, Holography Applications, (15 January 1988); doi: 10.1117/12.939057; https://doi.org/10.1117/12.939057
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