We present here a new technique of holographic interferometry for profile inspection of integrated circuit (IC) wafers. With this technique the lateral resolution of the profilometer will not be affected by the limitations on optical aperture. In addition, there are no stringent requirements on the spot size of the laser irradiation. A principal advantage of this system is that it needs no magnifying elements to give reasonable resolution for lateral measurements. Also the system will work even if multiple reflections exist.