23 December 1986 Transient Thermoreflectance Studies Of Thermal Transport Across Metal-Metal Interfaces
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We measure the thermal impedance of an interface in a thin metallic film using picosec-ond transient thermoreflectance. Our measurements on sputtered nickel-copper (Ni-Cu), nickel-molybdenum (Ni-Mo), nickel-titanium (Ni-Ti), and nickel-zirconium (Ni-Zr) indicate that the thermal impedance of the interface is directly related to the atomic size mismatch of the constituent elements. The interface decreases the thermal diffusion in the film compared to that measured for the constituent single element films.
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Carolyn A Paddock, Carolyn A Paddock, Gary L Eesley, Gary L Eesley, Bruce M Clemens, Bruce M Clemens, James P Stec, James P Stec, "Transient Thermoreflectance Studies Of Thermal Transport Across Metal-Metal Interfaces", Proc. SPIE 0678, Optical Thin Films II: New Developments, (23 December 1986); doi: 10.1117/12.939539; https://doi.org/10.1117/12.939539


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