10 December 1986 Full field stress analysis using the thermoelastic principle
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Abstract
This paper describes a new method of measuring stress on the surface of a structure subjected to dynamic loading. Although the theoretical relationship between the changes in temperature at a point on the surface and the related change in stress has been known for over 100 years, it has only recently been possible to measure reliably and without contact the small changes in temperature down to 0.001°K involved. The performance characteristics of an instrument for Stress Pattern Analysis by measurement of Thermal Emission (SPATE) and the results of measurements on real structures recently obtained will be described.
© (1986) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Lionel R. Baker, Lionel R. Baker, David E. Oliver, David E. Oliver, } "Full field stress analysis using the thermoelastic principle", Proc. SPIE 0685, Infrared Technology XII, (10 December 1986); doi: 10.1117/12.936492; https://doi.org/10.1117/12.936492
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